Integration of piezoelectric materials with substrates
US8466606B2 · kind B2 · utility
22Cited by
26References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2010 |
| Grant date | Jun 18, 2013 |
| Priority date | — |
| Expiry date | Jun 24, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.