Method for producing an electronic module by means of sequential fixation of the components, and corresponding production line
US8468691B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2007 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Sep 9, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing an electronic module including a printed-circuit board, at least one first-type component and one second-type component is disclosed. The process involves placing solder on the board, putting the first-type component in a first position, heating the entire board to melt the solder, resulting in soldering of the first-type component, putting the second-type component in a second position such that the second-type component has leads bearing on the board via the solder, and heating the solder locally to melt the solder such that the second-type component is soldered by applying two electrodes on each lead of the second-type component and making an electrical current flow between the electrodes to heat each lead of the second-type component. Each of the two electrodes directly contacts each lead of the second-type component to make the current flow between the two electrodes via the corresponding lead of the second-type component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.