Method of fabricating electrode structures on substrate
US8470150B2 · kind B2 · utility
2Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2011 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Jan 20, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D15/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods for fabricating electrode structures on a substrate are presented. The fabrication method includes providing a substrate with a patterned metal layer thereon, defining an electrode area. A passivation glue is formed on the patterned metal layer. An electrode layer is formed in the electrode area. A filling process is performed to deposit nano metal oxides on the electrode layer to extensively fill the entire electrode area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.