Method for making a cavity in the thickness of a substrate which may form a site for receiving a component
US8470184B2 · kind B2 · utility
1Cited by
1References
15Claims
0Family size
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Key dates
| Filing date | Apr 20, 2010 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Jul 12, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0315
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for making a micro-device including at least one receiving site for components, formed in a thickness of a substrate. The method includes: a) making in at least one first substrate adhesively bonded to a second substrate via a discontinuous adhesive bonding interface, at least one first trench around at least one sacrificial block of the first substrate, by etching the first substrate so as to expose the adhesive bonding interface; and b) removing the sacrificial block so as to make at least one first cavity in the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.