Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus
US8470438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2010 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Jul 2, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/268
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode 2 and a second connection electrode 10 are connected to each other with a conductive adhesive layer 9 therebetween includes organic films 6 and 11 formed on at least the first connection electrode and conductive particles 8 contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.