Photosensitive resin composition, color filter and method of producing the same, and solid-state imaging device
US8470502B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2009 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Jan 20, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L51/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive resin composition is provided which provides a high resolution even when a pattern is formed using a low exposure intensity (in particular, less than 200 mJ/cm2) and may inhibit deterioration in pattern rectangularity during a post baking process of a post treatment. The photosensitive resin composition includes: a resin; an oxime photopolymerization initiator; a UV absorbing agent; and a monomer containing a hydrogen bonding group, the amount of the monomer containing a hydrogen bonding group being 30 mass % or more with respect to the total solid content of the composition, and the photosensitive resin composition is used for forming a solid-state imaging device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.