Method for capping a MEMS wafer and MEMS wafer

US8470630B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Joachim Rudhard · Echterdingen, DE
• Thorsten Mueller · Reutlingen, DE

Key dates

• Filing date: Jun 25, 2009
• Grant date: Jun 25, 2013
• Expiry date: Nov 2, 2029

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0136
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

The invention relates to a method for capping a MEMS wafer (1), in particular a sensor and/or actuator wafer, with at least one mechanical functional element (10). According to the invention, it is provided that the movable mechanical functional element (10) is fixed by means of a sacrificial layer (14), and that a cap layer (19) is applied to, in particular epitaxially grown onto, the sacrificial layer (14) and/or to at least one intermediate layer (17) applied to the sacrificial layer (14). The invention also relates to a capped MEMS wafer (1).