Printable, flexible and stretchable diamond for thermal management
US8470701B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 3, 2009 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | May 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.