Epoxy resin composition and semiconductor device
US8470918B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2006 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Jan 9, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.