Heating device for wall, ceiling or floor coverings
US8471181B2 · kind B2 · utility
0Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2005 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Jan 28, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to a heating device and in particular to an element of a floor heating device. Known floor heating devices comprise heating means which are arranged underneath floor coverings, for example, below stone plates, tiles, parquet elements or laminated panels. Those heating means can be made of electrically heatable films which are arranged close to the surface of a covering in order to directly heat the room.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.