LED light disposed on a flexible substrate and connected with a printed 3D conductor
US8471274B2 · kind B2 · utility
20Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2012 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Jun 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/84
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An example includes subject matter (such as an apparatus) comprising a planar substrate including a first surface that is planar, at least one bare light emitting diode (“LED”) die coupled to the substrate and conductive ink electrically coupling the at least one bare LED die, wherein the conductive ink is disposed on the substrate and extends onto a surface of the LED that is out-of-plane from the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.