Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
US8471709B2 · kind B2 · utility
2Cited by
206References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2010 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Jun 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically interconnected to the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.