Method of making a bonded structure for an electrical component, and/or head gimbal assembly, head stack assembly, and disk drive unit incorporating the same
US8472142B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2007 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Apr 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10234
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present bonded structure uses metal ball to bond or weld the respective bonding surfaces of electrical pads which are arranged to face the same direction. The structure can be controlled visually and thus enables a high connection quality of no short circuit. In addition, the bonding operation of the bonded structure is carried out without using pressure, thus it will not damage surroundings of the electrical components. Accordingly, the manufacture yield is significantly improved and the cost is prominently reduced. The present invention also discloses a bonding method and a head gimbal assembly and a head stack assembly and a drive unit using the bonded structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.