Semiconductor power module, inverter, and method of manufacturing a power module
US8472188B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2010 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Apr 17, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor power module includes an insulated substrate with a plurality of power semiconductor devices mounted thereon and a heat sink for radiating heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the insulated substrate is bonded by metallic bonding to another surface of the base of the heat sink opposite the one surface of the base of the heat sink on which the radiation fins are formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.