Package for an implantable neural stimulation device
US8473048B2 · kind B2 · utility
11Cited by
16References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2006 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Jun 25, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.