Assembly method for implantable medical device
US8473056B2 · kind B2 · utility
20Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2008 |
| Grant date | Jun 25, 2013 |
| Priority date | — |
| Expiry date | Apr 25, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.