Solder apparatus
US8474681B1 · kind B1 · utility
0Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2012 |
| Grant date | Jul 2, 2013 |
| Priority date | — |
| Expiry date | Mar 1, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0623
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for presoldering electrical components can include a die device having a punch member for punching a solder preform from a sheet of solder, and pressing the solder preform against an electrical component. A heating device can press against the electrical component on a opposite side from the die device for sandwiching the electrical component between the punch member and the heating member, for heating the electrical component and melting the solder preform thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.