Semiconductor device assembly
US8475056B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2010 |
| Grant date | Jul 2, 2013 |
| Priority date | — |
| Expiry date | Aug 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02476
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A fiber coupled semiconductor device having an improved optical stability with respect to temperature variation is disclosed. The stability improvement is achieved by placing the platform holding the semiconductor chip and the optical fiber onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Attaching the optical fiber to a vertical mounting surface of a fiber mount, and additionally attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.