Patterning of thin film layers
US8475872B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2009 |
| Grant date | Jul 2, 2013 |
| Priority date | — |
| Expiry date | Oct 14, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/0446
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Simplified patterning of layers of a thin film is disclosed. In some embodiments, the patterning can include patterning a first conductive layer using a patterned dielectric layer as a mask and patterning a second conductive layer using a patterned passivation layer as another mask. In other embodiments, the patterning can include patterning a first conductive layer using a removable photosensitive layer as a mask, patterning a black mask layer using a removable photo mask, and patterning a second conductive layer using a patterned passivation layer as another mask. In still other embodiments, the patterning can include patterning a first conductive layer using a patterned black mask layer as a mask and patterning a second conductive layer using a patterned passivation layer as another mask. An exemplary device utilizing the thin film so patterned can include a touch sensor panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.