Method and structure of sensors or electronic devices using vertical mounting
US8476084B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2011 |
| Grant date | Jul 2, 2013 |
| Priority date | — |
| Expiry date | Oct 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting is presented. The method includes providing a substrate having a surface region and forming sensor(s) or electronic device(s) on a first region overlying the surface region. At least one bond pad structure can be formed from at least one trench structure. The resulting device can then be singulated within a vicinity of the bond pad structure(s) to form at least one integrated sensor or electronic devices having at least one vertical bond pad. At least one singulated device(s) can be coupled to a package, having a package surface region, such that the vertical bond pad(s) are configured horizontally, and at least one interconnection can be formed between the vertical bond pad(s) and at least one portion of the package surface region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.