Encapsulation methods and dielectric layers for organic electrical devices
US8476119B2 · kind B2 · utility
1Cited by
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23Claims
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Key dates
| Filing date | Mar 4, 2009 |
| Grant date | Jul 2, 2013 |
| Priority date | — |
| Expiry date | Mar 4, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.