Patent · US Active

Expanding void filler and a process of manufacturing same

US8476363B2 · kind B2 · utility

0Cited by
3References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 29, 2010
Grant dateJul 2, 2013
Priority date
Expiry dateOct 14, 2030

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J175/00
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

An adhesive composition, a process of manufacture and a method of filling a surface having voids with a void filler are disclosed herein. Upon insertion between opposing surfaces or around an exposed surface, the void filler expands into and around the voids, filling surfaces having voids and covering irregularities of concrete structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.