Expanding void filler and a process of manufacturing same
US8476363B2 · kind B2 · utility
0Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2010 |
| Grant date | Jul 2, 2013 |
| Priority date | — |
| Expiry date | Oct 14, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J175/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive composition, a process of manufacture and a method of filling a surface having voids with a void filler are disclosed herein. Upon insertion between opposing surfaces or around an exposed surface, the void filler expands into and around the voids, filling surfaces having voids and covering irregularities of concrete structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.