Microelectromechanical systems (MEMS) resonators and related apparatus and methods
US8476809B2 · kind B2 · utility
6Cited by
91References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 2012 |
| Grant date | Jul 2, 2013 |
| Priority date | — |
| Expiry date | May 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/241
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.