Wireless transceiver module
US8478197B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2009 |
| Grant date | Jul 2, 2013 |
| Priority date | — |
| Expiry date | Sep 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wireless transceiver module has a plurality of through holes and includes a wireless network chip, a circuit substrate, a Bluetooth chip, and a plurality of conductive connection structures. The Bluetooth chip is disposed between the circuit substrate and the wireless network chip, and the through holes are formed by passing through the wireless network chip, the circuit substrate, and the Bluetooth chip. The conductive connection structures are respectively disposed in the through hole. With the conductive connection structures, the Bluetooth chip, the wireless network chip, and the circuit substrate are electrically connected with each another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.