Method of producing wiring substrate
US8479385B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 15, 2011 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Oct 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing a wiring substrate includes producing a substrate body including a first primary surface on which a semiconductor chip mounting area is provided and a second primary surface opposed to the first primary surface; attaching a stiffener member on the first primary surface, the stiffener member including an opening which the semiconductor chip mounting area is exposed from; and connecting lead pins to corresponding connection pads provided on the second primary surface by way of electrically conductive members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.