Sound damping patch
US8479876B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2011 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Jun 10, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1002
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A panel assembly for use in any number of different applications, including a variety of vehicle applications, that reduces noise or vibrations, provides thermal insulation, and/or improves structural integrity. According to an exemplary embodiment, the panel assembly includes a main panel made from a metal, one or more sound damping patches also made from a metal, and an adhesive layer that joins the patches to the main panel in a constrained layer construction. The sound damping patches may include one or more forming features, which are designed to improve the formability of the panel assembly without significantly impairing its sound damping characteristics. There are different types of forming features, including internal forming features (e.g., openings, holes, slits, slots, etc.) located within the interior of the patch and external forming features (e.g., projections, fingers, recesses, waveforms, etc.) located along the perimeter of the patch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.