Polyurethane resin composition for mounting pad and polyurethane mounting pad using the same
US8481149B2 · kind B2 · utility
1Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2011 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Sep 15, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/42
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This disclosure relates to a polyurethane resin composition for a mounting pad, including a polyurethane resin, C9-15 alkyl benzene sulfonic acid or a salt thereof, and a DMF solvent, and a polyurethane mounting pad using the same, whereby long and large pores may be uniformly formed thereinside to provide a mounting pad having low hardness, excellent compressibility, and a high compression modulus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.