Method of attaching die to circuit board with an intermediate interposer
US8481861B2 · kind B2 · utility
1Cited by
57References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2011 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Jul 6, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2991
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.