Method for machining tapered micro holes
US8481887B2 · kind B2 · utility
4Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2008 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Jul 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09827
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for laser machining through micro-holes having desired geometric cross-section requirements in a thin, substantially homogenous material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.