Electron microscope specimen and method for preparing the same
US8481968B2 · kind B2 · utility
1Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2010 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Aug 21, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2001/2873
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for preparing an electron microscope specimen is provided. The method includes providing a wafer sample with an analysis region disposed thereon. A dicing process is performed to cut a sample piece from the wafer sample. The sample piece includes a target pillar structure wherein the analysis region is located on a top portion of the target pillar structure. A thinning process is performed to thin the top portion of the target pillar structure. The invention further provides an electron microscope specimen and a method of forming a 3D image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.