LED light source with thermally conductive luminescent matrix
US8481977B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2010 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | May 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8581
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A wavelength conversion chip is formed by depositing a wavelength conversion material on a substrate to form a layer, removing the resulting wavelength conversion layer from the substrate and then segmenting the wavelength conversion layer into a plurality of wavelength conversion chips. The wavelength conversion material can be annealed by thermal annealing or radiation annealing to increase the wavelength conversion efficiency of the chips or to sinter the wavelength conversion material to form a ceramic material. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.