Three-dimensional structure and its manufacturing method
US8482086B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 13, 2009 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Oct 17, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0292
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A plurality of three-dimensional structure configuring devices, each including an elastic body in which micro three-dimensional structure elements fixed to a substrate member are placed so as to be covered therewith and which is fixed to the substrate member, are placed within a film-like elastic body with the substrate members thereof spaced apart from one another so as to configure a three-dimensional structure. Thereby, the plurality of three-dimensional structure configuring devices can be placed with desired intervals of arrangement and in desired positions within the film-like elastic body and so that various specifications can be addressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.