Patent · US Active

Interconnect structure comprising blind vias intended to be metalized

US8482130B2 · kind B2 · utility

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0References

11Claims

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Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Damien Saint-Patrice · Valence, FR
Sébastien Bolis · Crolles, FR
Fabrice Jacquet · Le Pont-de-Claix, FR

Key dates

Filing date	Feb 22, 2011
Grant date	Jul 9, 2013
Priority date	—
Expiry date	Mar 22, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/9202
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An interconnect structure including:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.