Sensor assembly and method of measuring the proximity of a machine component to an emitter
US8482456B2 · kind B2 · utility
0Cited by
61References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2010 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Jul 2, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B7/023
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microwave sensor assembly includes at least one probe including an emitter configured to generate an electromagnetic field from at least one microwave signal. The emitter is also configured to generate at least one loading signal representative of a loading induced within the emitter by an object positioned within the electromagnetic field. The microwave sensor assembly also includes a signal processing device coupled to the at least one probe. The signal processing device includes a linearizer configured to generate a substantially linear output signal based on the at least one loading signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.