Low profile antenna assemblies
US8482466B2 · kind B2 · utility
8Cited by
19References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2012 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Jul 18, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/0421
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna assembly including a ground plane and a radiator supported above the ground plane is disclosed. The radiator may include a slot to configure the radiator to be resonant in at least two frequency ranges and a grounding point coupled to the ground plane. The radiator may be a dual-band planar inverted F antenna (PIFA) having an upper surface opposite the ground plane. First and second antenna modules may be coupled to the upper surface of the PIFA. The first and second antenna modules may be patch antennas, such as stacked patch antennas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.