Device for cooling an electronic card by conduction comprising heat pipes, and corresponding method of fabrication
US8482920B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2008 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Apr 27, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1404
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a device for cooling an electronic circuit board comprising at least one component covered with an exchanger cover, the device includes a heat sink covering all or some of the electronic circuit board, and at least one heat pipe per component, each heat pipe being capable of carrying away the heat from the component with which it is associated to at least one end of the electronic circuit board via a zone of the heat pipe called the condensing zone. The device further includes at least one heat-exchange part located on the end of the electronic circuit board and mounted freely on the heat sink, each heat pipe being attached to the heat-exchange part by means of its condensing zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.