Systems for circuit board heat transfer and method of assembling same
US8482929B2 · kind B2 · utility
10Cited by
12References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2011 |
| Grant date | Jul 9, 2013 |
| Priority date | — |
| Expiry date | Jun 27, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the PCB and the heatframe, and at least one thermal via extending through the PCB and coupled to the TIM, wherein the assembly is configured to transfer heat from the PCB to the chassis through the TIM and the at least one thermal via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.