Optical transceiver module having a deformable heat sink structure
US8485739B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2011 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Jan 20, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4269
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A heat dissipation solution is provided that includes a heat sink structure that has a very high thermal conductivity and includes elements or features that can be deformed to increase the contact surface areas between the heat sink structure and the module casing, thereby decreasing thermal resistance. By increasing the thermal conductivity and the sizes of the surface areas that are used for transferring heat, the temperature difference between the temperature of the light source and the temperature of the module casing can be decreased to enable the light source to be operated at higher data rates. Furthermore, deformation of the deformable features also removes space between the optical subassembly and the module body caused by mechanical tolerance differences that occur during manufacturing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.