Telemetric orthopaedic implant
US8486070B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2006 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Oct 19, 2029 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2002/4688
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An instrumented orthopaedic implant, such as an intramedullary (IM) nail, is disclosed. The implant has the capacity to provide an accurate measurement of the applied mechanical load across the implant. The implant includes sensors and associated electronic components located in recesses on the outer surface of the implant. The implant houses the sensing apparatus, the interface circuitry, the data transmitter, and the power receiver. The hermetically sealed housing is adapted for implantation in the body of a patient. The implant is used with a controller which communicates with it by telemetry, and there is an acting unit connected to the electronic components which is adapted to carry out a function based upon a condition detected by the sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.