Magnetic field sensors and methods for fabricating the magnetic field sensors
US8486755B2 · kind B2 · utility
30Cited by
67References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2008 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Dec 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.