Patent · US Active

Method for thermally contacting opposing electrical connections of a semiconductor component arrangement

US8486766B2 · kind B2 · utility

3Cited by

5References

21Claims

0Family size

Assignee

Jenoptik Laser GmbH · DE

Inventors

Matthias Schroeder · Badendorf, DE
Dominic Schroeder · Lütjenburg, DE
Petra Hennig · Königs Wusterhausen, DE

Key dates

Filing date	Sep 8, 2010
Grant date	Jul 16, 2013
Priority date	—
Expiry date	Sep 8, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/405
WIPO fieldOptics
WIPO sectorInstruments

Abstract

The invention relates to thermally contacting a semiconductor component arrangement, wherein at least one of two heat conducting bodies disposed on opposite sides of the semiconductor component arrangement is brought into contact with a contact surface of the semiconductor component arrangement by means of a metal layer under the application of a force, wherein the metal layer melts during solidification of a locking agent, forming an adhesive bond between the two heat transfer bodies over the entire region thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.