Thermosetting polymer-based composite materials
US8487029B2 · kind B2 · utility
6Cited by
13References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Jan 22, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/019
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A lead-free, non-toxic composite material including a thermosetting polymer and at least one of a heavy particulate filler, a light particulate filler or a combination thereof. The composite material may be utilized in manufacturing articles used in radiation shielding applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.