Conductive plate
US8487193B2 · kind B2 · utility
0Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2010 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Apr 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0323
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive plate includes a substrate, an adhesive, and a conductive layer attached to the substrate through the adhesive. The conductive layer includes a plurality of conductive films, each of which includes a plurality of nanounits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.