Circuit board including an embedded component
US8487194B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2010 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | May 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The document describes a circuit board and an electronic module, including a conductor-pattern layer, an insulating-material layer supporting the conductor-pattern layer, and at least one component inside the insulating-material layer. The component has a plurality of contact areas and the circuit board or electronic module includes contact elements between the conductor-pattern layer and contact areas for electrically connecting the conductor-pattern layer and the at least one component such that at least two of the contact elements are in direct contact with a common contact area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.