Via structure for multi-gigahertz signaling
US8487195B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 4, 2010 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Jun 5, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A via structure is disclosed to pass electronic signals from a first conductive pathway formed on a first outermost substrate of a multi-layer PCB to a second conductive pathway formed on a second outermost substrate of the multi-layer PCB. The via structure allows the electronic signals to pass from the first outermost substrate through one or more inner substrates to the second outermost substrate. The one or more inner substrates include one or more closed geometric structures to enclose the via structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.