Method of marking or inscribing a workpiece
US8487212B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2009 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Dec 27, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C17/32
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention provides a method of and apparatus for marking or inscribing a workpiece (3) with high-energy radiation, more particularly with a laser beam (1), the workpiece (3) having a light-scattering surface (9) and the material of the workpiece (3) being transparent for the radiation wavelength, and a polymer matrix (7) being disposed on the workpiece (3) in such a way that the radiation passes through the workpiece (3) and its light-scattering surface (9) before impinging on the polymer matrix (7), characterized in that the light-scattering surface (9) of the workpiece (3) is wetted with a liquid or viscoelastic medium (11).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.