LED package and method for manufacturing the same

US8487333B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• MENG-HSIEN HONG · Hsinchu, TW
• Ko-Wei Chien · Hsinchu, TW

Key dates

• Filing date: Jun 30, 2011
• Grant date: Jul 16, 2013
• Expiry date: Dec 16, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/856

Abstract

An LED package includes a substrate, an LED chip, and an encapsulation. The substrate includes a first surface. The LED chip is mounted on the first surface of the substrate. The encapsulation covers the LED chip. The encapsulation includes a transparent main body and a number of carbon nanotubes distributed in the transparent main body; the carbon nanotubes are arranged substantially extending along a same direction whereby light generated by the LED chip is polarized prior to radiation out of the encapsulation.