Coaxial power module
US8487416B2 · kind B2 · utility
4Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2011 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Dec 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.