Patent · US Active

LED package

US8487418B2 · kind B2 · utility

5Cited by

0References

15Claims

0Family size

Assignee

Kabushiki Kaisha Toshiba · JP

Inventors

Hidenori Egoshi · Itoshima, JP
Kazuhiro Tamura · Fukuoka, JP
Hiroaki Oshio · Yokohama, JP
Satoshi Shimizu · Tokyo, JP
Teruo Takeuchi · Kitakyushu, JP
Kazuhiro Inoue · Itoshima, JP
Iwao Matsumoto · Kawasaki, JP

Key dates

Filing date	Sep 20, 2010
Grant date	Jul 16, 2013
Priority date	—
Expiry date	Jul 24, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

According to one embodiment, an LED package includes (2×n) (n is an integer of 2 or more) lead frames, n LED chips and a resin body. The (2×n) lead frames are arranged to be apart from each other. The n LED chips are provided above the lead frames. Each of the n LED chips has one terminal connected to each of n lead frames of the (2×n) lead frames and another terminal connected to each of lead frames of the (2×n) lead frames other than the n lead frames. The resin body covers the (2×n) lead frames and the n LED chips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.