Dual-substrate capacitive touch panel
US8487904B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 6, 2010 |
| Grant date | Jul 16, 2013 |
| Priority date | — |
| Expiry date | Mar 19, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A capacitive touch panel sequentially has a first glass substrate, a lower touch sensitive layer, a lower insulation ink layer, a lower conductor layer, a lower insulation layer, a lower conductive adhesive layer, a flexible circuit board, a transparent insulation adhesive layer, an upper insulation layer, an upper conductive adhesive layer, an upper conductor layer, an upper insulation ink layer, an upper touch sensitive layer and a second glass substrate. The aforementioned structure allows fabrication of the capacitive touch panel to be separated into a lower panel fabrication process and an upper panel fabrication process. The two independent fabrication processes prevent the capacitive touch panel from being damaged in one of the processes when the process is completed so as to increase the yield in production and further facilitate producing large-size touch panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.